Artificial Intelligence for Virtual Conferences
September 23, 2020
CALL FOR PRESENTATIONS AND PARTICIPATION
A shift from physical conferences to a new virtul or hybrid model seems inevitable and possibly urgent, as evidenced by the CoVid-19 pandemic. While presentations may be easily delivered online, how to effectively realize other essential components of a conference, such as human interactions, networking, exhibitions, etc., in a large scale presents a new challenge to associations and professional communities.
We hope the challenge can eventually turn into an opportunity, with a marriage of AI (Artificial Intelligence) and conferences, and we use the term “ai4vc” to designate the shift from the traditional conference model to its next generation, which may be virtual or hybrid.
Artificial Intelligence for Virtual Conferences (ai4vc 2020) is an international forum for academia and industries to exchange visions and ideas of the paradigm shift. The conference is calling for presentations that address the organizational, business, operational, and technical aspects of virtual or hybrid conferences.
To substantiate the theme, the track will be carried out virtually, at a special registration rate of USD$150 (for authors) and USD$75 (for general attendees).
Authors are invited to submit a 2-page research summary or vision statement in double-column IEEE format to (please include 'ai4vc submission' as the subject). Manuscripts must be written in English and follow the instructions in the IEEE Manuscript Formatting and Templates guidelines. Distinguished quality presentations at the conference will be invited to be extended for publication in the post-conference proceedings (to be submitted to the IEEE Xplore® and/or IEEE Computer Society Press digital library) and internationally renowned journals.
Submission Deadline: September 12, 2020
Ajay Bansal, Arizona State University, USA
Giovanni Pilato, Italian Research Council, Italy
Phillip Sheu, University of California, Irvine, USA
Jeffrey Tsai, Asia University, Taiwan
Alexander Wachtel, Karlsruhe Institute of Technology, Germany